India plans to extend the tenure of the India Semiconductor Mission (ISM) 2.0. The centre is considering a 12-year implementation window rather than the current five-year framework. The progress comes as New Delhi eyes sharpening its long-term semiconductor manufacturing and supply chain strategy. The move is aimed
India’s semiconductor push is set to gather pace with the country’s third chip manufacturing plant expected to begin operations in July, while a fourth facility is likely to be ready by November or December, said Ashwini Vaishnaw, Union Electronics and Information Technology Minister. The announcement for
India will soon stand tall as a trusted global partner in the value and supply chains for electronics manufacturing, said Union Minister Ashwini Vaishnaw. While attending the ground-breaking ceremony of the Google Cloud India AI Hub, the minister said the government has clearly outlined its strategy
Ashwini Vaishnaw, Minister for Railways, Information & Broadcasting and Electronics & Information Technology, Government of India, has pitched Visakhapatnam as a future hub for artificial intelligence, informally branding it “AI Patnam” as India positions itself as a trusted global partner in electronics and AI infrastructure. Read
India is positioning itself as a reliable partner in global electronics and supply chains, backed by policy support and growing domestic capabilities, Union Minister for Electronics and IT Ashwini Vaishnaw stated while speaking at the groundbreaking ceremony of the Google Cloud India AI Hub in
HCL Technologies and Foxconn have selected CTCI Corporation as the engineering, procurement and construction (EPC) partner for their upcoming semiconductor facility in Uttar Pradesh. The move marks a key step toward advancing India’s domestic chip manufacturing ambitions as part of its broader semiconductor push. Also Read: Sarvam AI
The Indian government is preparing to roll out the second phase of its semiconductor incentive programme with a proposed outlay of ₹1.2 lakh crore. With the plan ready, the government aims to strengthen domestic chip manufacturing and design capabilities. The move comes as part of the
India’s first 3D semiconductor fabrication facility in Odisha has secured full production capacity even before its official launch. The moment reflects rising demand for advanced chip packaging and a growing domestic semiconductor ecosystem. Industry experts said that early bookings show the confidence of global and domestic
The Indian government has approved the country’s first semiconductor-focused Special Economic Zone (SEZ) to support Tata Group’s planned chip manufacturing facility in Dholera, Gujarat. The project, valued at around ₹91,000 crore, stands tall as India’s push to build a domestic semiconductor ecosystem and reduce import dependence. Also
India’s semiconductor mission is set to sharpen its focus on research and development (R&D). The Ministry of Electronics and Information Technology (MeitY) has indicated a broader push beyond manufacturing incentives. A senior government official said the next phase of the programme will prioritise innovation, design capabilities