HCL Technologies and Foxconn have selected CTCI Corporation as the engineering, procurement and construction (EPC) partner for their upcoming semiconductor facility in Uttar Pradesh.

The move marks a key step toward advancing India’s domestic chip manufacturing ambitions as part of its broader semiconductor push.

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EPC Partnership Signals Project Momentum

The appointment of CTCI formalises a critical phase in the development of the semiconductor plant, which is being set up as part of the HCL-Foxconn joint venture. As the EPC partner, CTCI will be responsible for designing, building and delivering the facility within defined timelines.

The selection follows prior approvals and groundwork for the project, indicating steady progress toward execution. Industry experts note that the development signals that large-scale semiconductor investments in India are moving from planning to implementation.

The Uttar Pradesh facility will focus on display driver chips, a segment widely used in smartphones, laptops and other consumer electronics. These components account for a major share of the global semiconductor supply chain.

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Strengthening India’s Semiconductor Ecosystem

The project aligns with the Indian government’s push to build a domestic semiconductor ecosystem and reduce reliance on imports. With global supply chains disrupted over the past few years, India has stepped up incentives to attract chipmakers and related infrastructure investments.

The HCL-Foxconn venture is among many semiconductor proposals being pursued across states, including Gujarat & Tamil Nadu. Uttar Pradesh’s inclusion will broaden the geographic spread of such investments.

Analysts note that partnerships with established global firms such as Foxconn and CTCI bring execution expertise and supply chain linkages, which are critical to the success of such capital-intensive projects.

Once operational, the facility will contribute to local manufacturing, job creation and the development of technology capabilities. It also adds to India’s positioning as a potential alternative hub in the global semiconductor value chain.