The foundation stone for a new semiconductor manufacturing unit by a joint venture between India’s HCL Group and Taiwan-based Foxconn is scheduled to be laid on February 21 at the Yamuna Expressway Industrial Development Authority area, Sector 28.
The event, scheduled in the Yamuna City region near Noida, will be attended by Uttar Pradesh Chief Minister Yogi Adityanath and Union Minister for Information Technology and Electronics Ashwini Vaishnaw, with Prime Minister Narendra Modi expected to address the ceremony virtually.
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Project Details and Strategic Industry Context
The plant is being developed by Vamasundari Investments Pvt Ltd, a joint venture between HCL and Foxconn, with an estimated investment of ₹3,706 crore under the government’s India Semiconductor Mission programme.
Spread over 48 acres in Sector 28, the facility will focus on manufacturing compound semiconductors, sensors and outsourced semiconductor assembly and testing components. It is among six semiconductor units approved by the central government to strengthen domestic chip production capacity.
Officials say the unit will have the capacity to process 20,000 wafers per month and produce display driver chips used in devices such as mobile phones, laptops, personal computers and automobiles. The project is expected to create around 3,780 jobs and serve as a keystone for an electronics and semiconductor cluster in the YEIDA region, bolstered by the proximity of the upcoming Noida International Airport.
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Ceremony, Leadership and Next Steps
The foundation event marks a significant milestone in Uttar Pradesh’s bid to become a semiconductor manufacturing hub in northern India. Chief Minister Yogi Adityanath will chair the ceremony, alongside Union IT and Electronics Minister Ashwini Vaishnaw.
Work at the site is expected to accelerate now that foundational formalities are in place, with production anticipated to begin in line with broader industry timelines.
