India’s semiconductor mission is set to sharpen its focus on research and development (R&D). The Ministry of Electronics and Information Technology (MeitY) has indicated a broader push beyond manufacturing incentives. A senior government official said the next phase of the programme will prioritise innovation, design capabilities
India is recalibrating its semiconductor strategy under the Semicon Mission 2.0. A sharper focus will be placed on attracting investment in memory chip manufacturing, as the government looks to boost its position in the global electronics supply chain. Officials are now prioritising segments such as DRAM
Union Minister for Electronics and Information Technology Ashwini Vaishnaw has signalled progress in the country’s efforts to build a domestic chip ecosystem. India is set to operationalise four semiconductor manufacturing plants within the year, he highlighted. The move comes as India pushes a broader policy to
India’s push to scale up semiconductor manufacturing and printed circuit board (PCB) production is facing uncertainty due to disruptions in helium supply. The trigger comes as a ripple effect to the ongoing Iran-Israel conflict. Industry stakeholders warn that rising input costs and constrained availability of
India’s semiconductor ambitions are facing cost pressures amid the ongoing conflict in West Asia, which is disrupting energy markets and global supply chains. Industry executives and analysts say rising crude prices and logistics disruptions are increasing the “real cost” of setting up and operating chip
While the world’s attention is rightfully fixed on the rising costs of LPG cylinders and the immediate humanitarian crisis caused by the war in Iran, a silent, invisible shortage is brewing in the high-tech corridors of the semiconductor world. Unlike petroleum, which powers our transport,
Prime Minister Narendra Modi attended the groundbreaking ceremony of the HCL–Foxconn semiconductor manufacturing unit in Uttar Pradesh. Attending the event via video conferencing, he said the moment marks a key step in India’s push to build a domestic semiconductor ecosystem. The facility, to be set up
The foundation stone for a new semiconductor manufacturing unit by a joint venture between India’s HCL Group and Taiwan-based Foxconn is scheduled to be laid on February 21 at the Yamuna Expressway Industrial Development Authority area, Sector 28. The event, scheduled in the Yamuna City region
Finance Minister Nirmala Sitharaman is currently delivering the Union Budget 2026–27 live in Parliament, marking her ninth consecutive budget presentation, and the country is closely watching every major announcement as it unfolds. As the live coverage continues, one of the standout policy thrusts revealed is the
Odisha has laid the foundation stone for a ₹2,067 crore compound semiconductor manufacturing facility at the Info Valley-II Tech Park near Bhubaneswar. The initiative aligns with the national drive under the India Semiconductor Mission (ISM) to build a robust, end-to-end chip manufacturing ecosystem within the