Odisha has cleared the way for SiCSem Private Limited to set up a ₹3,406.25-crore silicon carbide semiconductor manufacturing unit near Bhubaneswar.
The progress marks another step in the state’s push to build a semiconductor manufacturing base.
The Unit Approval Committee (UAC) of the Falta Special Economic Zone under the Ministry of Commerce and Industry approved the proposal. The Odisha semiconductor unit will span 21.889 acres at the Electronic System Design and Manufacturing (ESDM) Park in Info Valley-II.
Also Read: Odisha Semiconductor Plant: ₹2,067 Cr Facility to Strengthen India’s Tech Manufacturing Ecosystem
SiCSem Unit to Make 96 Million Semiconductor Devices Annually
The integrated facility will cover the full manufacturing chain, including fabrication, assembly, testing, marking and packaging of silicon carbide (SiC) semiconductor devices.
SiCSem plans to manufacture 4.8 million SiC diodes and 91.2 million SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) every year.
These devices are used in applications that require high power efficiency, high-temperature performance and faster switching. The project is also expected to strengthen domestic production of specialised power semiconductor devices and reduce dependence on overseas supply chains.
The UAC minutes from its 217th meeting on August 29 said SiCSem is projected to generate export turnover of around ₹7,043 crore during its first five years of operations. Net foreign exchange earnings are estimated at ₹4,523 crore over the same period.
The facility is expected to create employment for around 1,270 people.
Odisha Builds a Wider Semiconductor Ecosystem
The SiCSem project is part of a broader plan to establish an integrated semiconductor manufacturing capability in Odisha rather than focusing on a single stage of production.
SiCSem has also established the Silicon Carbide Research and Innovation Centre (SICRIC) at IIT Bhubaneswar with a ₹64 crore investment. The centre is intended to support research and innovation in SiC technology and strengthen links between industry and academia.
Odisha has secured commitments from five semiconductor companies, involving combined investments of ₹10,899 crore. RIR Power Electronics has already processed the construction phase with its ₹620-crore unit.
US-based 3D Glass Solutions has also proposed a ₹1,943-crore advanced packaging and embedded glass substrate facility. The company has collaborated with Intel for the country’s first 3D chip packaging plant.
The approval moves Odisha’s semiconductor story from project proposals toward a broader manufacturing ecosystem. SiCSem will add fabrication & downstream production capacity to the state’s growing chip sector.
Samarjit Kaur is a journalist and communications professional covering technology & emerging digital trends. With a focus on clarity and context, she reports on developments shaping industries and governance. When not reporting, she chooses to plug-in and relax on her playlists and plan her next bucket-list trips!
