The Indian government is preparing to roll out the second phase of its semiconductor incentive programme with a proposed outlay of ₹1.2 lakh crore. With the plan ready, the government aims to strengthen domestic chip manufacturing and design capabilities. The move comes as part of the
Union Minister for Electronics and Information Technology Ashwini Vaishnaw has signalled progress in the country’s efforts to build a domestic chip ecosystem. India is set to operationalise four semiconductor manufacturing plants within the year, he highlighted. The move comes as India pushes a broader policy to