The Indian government is preparing to roll out the second phase of its semiconductor incentive programme with a proposed outlay of ₹1.2 lakh crore. With the plan ready, the government aims to strengthen domestic chip manufacturing and design capabilities. The move comes as part of the
India’s first 3D semiconductor fabrication facility in Odisha has secured full production capacity even before its official launch. The moment reflects rising demand for advanced chip packaging and a growing domestic semiconductor ecosystem. Industry experts said that early bookings show the confidence of global and domestic
India’s semiconductor mission is set to sharpen its focus on research and development (R&D). The Ministry of Electronics and Information Technology (MeitY) has indicated a broader push beyond manufacturing incentives. A senior government official said the next phase of the programme will prioritise innovation, design capabilities