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India’s first 3D semiconductor fabrication facility in Odisha has secured full production capacity even before its official launch. The moment reflects rising demand for advanced chip packaging and a growing domestic semiconductor ecosystem. Industry experts said that early bookings show the confidence of global and domestic

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Odisha has laid the foundation stone for a ₹2,067 crore compound semiconductor manufacturing facility at the Info Valley-II Tech Park near Bhubaneswar. The initiative aligns with the national drive under the India Semiconductor Mission (ISM) to build a robust, end-to-end chip manufacturing ecosystem within the

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