India Targets Global Semiconductor Leadership by 2047, DRDO Highlights Next-Generation Chip Technologies

India aims to become a globally competitive semiconductor powerhouse by 2047, with DRDO highlighting next-generation chips, AI processors and indigenous defence technologies.

By Samarjit Kaur

on November 2, 2026

The Ministry of Defence (MoD) said India aims to become a competitive, technologically self-reliant global semiconductor leadership powerhouse by 2047, focusing on next-generation chip technologies.

The vision also includes building a sustainable domestic semiconductor ecosystem, creating high-value employment opportunities & strengthening India’s capabilities in chip design, manufacturing and defence electronics.

The announcement came as the Defence Research and Development Organisation (DRDO) participated in the Emerging Science, Technology and Innovation Conclave (ESTIC) 2026.

Also Read: HCLTech, Japan’s Rapidus Partner to Advance Next-Generation Semiconductor Technologies

DRDO Leads Discussions on Next-Generation Semiconductor Technologies

DRDO, one of the key organisers of ESTIC 2026, led a thematic session titled ‘Semiconductors & Next-Generation Chips’. B K Das, Director General of Electronics and Communication Systems (ECS), chaired the session.

It brought together representatives from industry, academia, India’s domestic chip development ecosystem and defence electronics.

Discussions covered emerging semiconductor technologies, artificial intelligence (AI)-based system-on-chips (SoCs), intelligence at the silicon edge and developments in microprocessors.

The session also examined DRDO’s role in helping industries and startups develop new solutions, speed up next-generation chip design and strengthen core technologies developed within India.

Also Read: AI-Powered Digital Twins: Semiconductor Market Set to Hit $42.42 Billion by 2035

Semiconductor Self-Reliance Central to Viksit Bharat 2047

According to the ministry, semiconductor technology is imperative to national sovereignty, economic strength and digital security. It is also an important part of the government’s Viksit Bharat 2047 and Aatmanirbhar Bharat ambitions.

Chips determine the performance, efficiency and reliability of several modern technologies, including communication devices, advanced sensing systems and defence platforms.

The ministry said technological self-reliance would require capabilities across the entire semiconductor value chain, extending beyond chip manufacturing to design, fabrication, testing, industrial-scale production and resilient supply chains.

Also Read: L&T Semiconductor, Tata Electronics Join Hands to Expand Chip Manufacturing in India

DRDO Showcases Indigenous Defence Technologies at ESTIC 2026

Prime Minister Narendra Modi inaugurated ESTIC 2026, which 12 ministries and departments organised jointly under the guidance of the Principal Scientific Adviser to the Government of India. Its theme was ‘Creative Minds, Catalysing Science, Empowering Society’.

The conclave featured research, deep-tech developments and discussions involving Nobel laureates, international experts, policymakers and emerging leaders.

DRDO’s outreach stall showcased technologies developed by its laboratories, including advanced communication systems, quantum technology prototypes, extreme-cold-weather clothing, the PRABALA female full-body protector, passive and powered exoskeletons, portable hybrid energy management systems, high-power pulse laser diodes and scramjet engine technology.

India’s 2047 semiconductor ambition will depend on building capabilities across the chip value chain, from indigenous design and fabrication to testing and large-scale production. The ministry’s emphasis on next-generation chips and defence applications places technological self-reliance at the centre of that long-term objective.

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